Silvaco wins contract for software modelling project

St Ives, Cambridge, - Friday, Dec. 02, 2011.

Cambridge based Silvaco Europe Ltd is part of a pan-European team awarded €4.9m funding to develop advanced software modelling methods.
The collaboration is designed to revolutionise the design efficiency of the complex semiconductor components needed in critical applications.

Silvaco Europe in the UK is a leading provider of computer aided design (TCAD) and electronic design automation (EDA) software.

Use of high levels of integration in heterogeneous system-in-package (SiP) circuit designs results in smaller, smarter and more energy efficient products for aerospace, automotive, healthcare and consumer electronics.

The latest project, named PARSIMO (PARtitioning and MOdelling of SiP), will last three years and has been sponsored by ENIAC JU, the public-private partnership that brings together the European Commission with researchers in the nanotechnology sector.

Collaborating with Silvaco are Thales Airborne Systems, Coventor, SARAS Technology, University of Sheffield, ESIEE Engineering, Institute of Electron Technology (ITE), Wroclaw University of Technology and ENSICAEN/LaMIPS.

PARSIMO will investigate modelling methods to improve the predictive accuracy for SiP design, while reducing simulation time to optimise cost and performance using new partitioning methods. By cutting manufacturing costs, SiP solutions will be attainable for small and medium-sized enterprises (SMEs) - a key sector in European economic recovery.

The ENIAC JU project has brought together leading European specialist engineers to speed design and automate production of new advanced heterogeneous components.

“The main goal of PARSIMO is to organise tools and methodologies to improve design efficiency for complex components needed in critical applications”, said Dr Ahmed Nejim of Silvaco Europe.

“The multi-disciplinary approach brings together a highly specialised team capable of significant strides in this important area.”

“System-in-Package design is an enabler of new and pervasive applications incorporating mixed-signal systems, sensors and wireless devices in 3D. PARSIMO provides an opportunity for leading European specialists to speed up design using off-the-shelf components and make such technologies accessible, particularly to SMEs,” said Professor Merlyne De Souza of Sheffield University who is also coordinator of the project.